TSP-AS Wave Absorbing Thermal Gap Pad

Material Features

As low as $283.2/m at 0% APR With paypal_credit

Describe： TSP-AS series is a high deflection and hybrid version of electromagnetic absorber and thermal interface material. This product is used like a traditional thermal pad between a heat source and a heat sink or other heat transfer component, while surpressing unwanted energy coupling, resonances

· High deflection and low compression force
· Good thermal conductivity
· Good EMI suppression
· Meets flamability requirements
· Natural tacky on both sides

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AVAILABLE OPTIONS

· Standard sheet size: 18"x18" or 18"x9"

· 1-side / 2-side adhesive lamination

· Available in sheet or precut finished parts

PROPERTY		TSP150AS	TSP200AS	TSP300AS	TEST METHOD
Color		Dark Gray	Dark Gray	Medival Black	Visual
Thickness (mm)		0.30~3.5	0.5 ~ 3.0	0.5 ~ 3.0	----
Hardness (Shore 00)		60	40~60	50-70	ASTM D2240
Density (g/cm3)		3	3.28	3.8	ASTM D792
Continuous Use Temp (℃)		-45 to 140	-40 to 160	-40 to 160	EN344
Tensile Strength (MPa)			0.8	≥0.2	ASTM D412
Elongation (%)		8	72	≥150	ASTM D412
RoHS & REACH		Compliance	Compliance	Compliance	IEC 62321 & EN14372
Electromagnetic Permeability	8+/-20%,(U') @1MHz		≥2	≥5.5	Agilent E4991A
Power Loss	3.5+/-20%,(U') @1MHz		<0.1	<0.1
	2+/-20%,(U') @1MHz		15±5	≥2.0
	1.0mm, 20%				@1GHz
	2.0mm, 23%		2	3
	3.0mm, 26%